| 1. | Test method for sheet resistance of gold plating layer
金电镀层薄层电阻测试方法 |
| 2. | Plated layer of plated metal strip
金属捆片电镀层 |
| 3. | Study on three price chromium colored passivation technology of zinc - plated layer
镀锌层三价铬彩色钝化工艺研究 |
| 4. | The reasons and resolve of plating layer blister on multilayer ceramic package
多层陶瓷外壳电镀层起泡的成因和解决措施探讨 |
| 5. | The great amount of stabilizing agent led to the non - uniform of the plating layer . the addition of the high polymer could decrease the size of silver particles and help to increase the dispersibility of powders
采用高铜镀液，镀覆表面金属颗粒降至2 3urn ，形成一层致密连续的铜银共沉积的金属膜层。 |
| 6. | The technological steps and conditions of chemical silver plating and copper plating are researched systematically . the effect factors that can affect the conductivity of the plating layer are all analyzed specially
在此基础上开展化学镀的各步工艺条件的研究，摸索出一套化学镀银和化学镀铜的各步工艺条件和配方配比。 |
| 7. | The wet plating method permits to improve the adhesion of plating layers by treating the surface of polymers with an acid to generate the concavo - convex and forming the polar functional groups ( see , metal surface compendium , plastic plating techniques , page 13 )
湿镀方法可以改进镀层的粘附能力，其方法是用酸处理聚合物表面，以产生凸凹并形成极性基团。 |
| 8. | The thickness of the silver plating layer is in the range of 0 . 2 m ~ 0 . 5 m . through dta , it is proved that the metal plating layer is compatible with the substrate very well . the research on the testing of the complex decoy ' s properties is detailed below
该文还重点分析了影响镀层导电性的因素；确定了镀银层厚度大致范围在0 . 2 m 0 . 5 m ；通过差热试验，证实了镀层金属与基片是完全相容的性质。 |
| 9. | Nanometer tio2 particles were well distributed in ni - p plating layer on steel surface by electroless plating . " the study showed their effects on photocatalytic degradation for methylene blue were equa1 to the tio2 powder capability of photocatalytic
同时本文利用化学复合镀在钢铁基体上形成ni - p -纳米tio _ 2复合镀层，该复合镀层对次甲基蓝有较好的光催化降解作用，其催化性能与粉末状纳米tio _ 2的催化性能大致相当。 |
